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Your search returned 22 records. Click on the hyperlinks to view further details of Titles.. |
Magazine Name : Ieee Transactions On Components And Packaging Technologies
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Year : 2001 Volume number : 24 Issue: 02 |
Assessment Of High-Heat Flux Thermal Management Schemes
(Article)
Subject:
Avionics
,
Electronic Cooling
,
Flow Boiling
,
Spray
Author:
I
Mudawar
page:
122
-
141
Modeling Of The Thermal And Hydraulic Performance Of Plate Fine, And Pin Fin Heat Sinks Influence Of Flow Bypass
(Article)
Subject:
Bypass
,
Circularity
,
Experimental
,
Heat Sink
Author:
Hans
Jonsson
Bahram
Moshfegh
page:
142
-
149
Design For Manufacturability Of Sise Parallel Plate Forced Convection Heat Sinks
(Article)
Subject:
Bonding
,
Design For Manufacturability
,
Folding Adc'S
,
Forging
Author:
Madhusudan
Lyengar
Avram
Bar-Cohen
page:
150
-
158
Optimization Of Plate Fin Heat Sinks Using Entropy Generation Minimization
(Article)
Subject:
Electronics
,
Entropy Production
,
Optimization
Author:
J. Richard
Culham
Y. S
Muzychka
page:
159
-
165
Immersion-Cooled Heat Sinks For Electronices Insight From High Speed Photography
(Article)
Subject:
Heat Transfer
,
Passive Thermal
,
Thermal Management
Author:
Sushil H.
Bhavnani
Richard C.
Jaeger
page:
166
-
176
A Methodlogy For The Design Of Perforated Tiles In Raised Floor Data Centers Using Computational Flow Analysis
(Article)
Subject:
Data Center Management
,
Flow Boiling
,
Flow Network Modeling
Author:
Sukhvinder
Kang
Roger R.
Schmidt
page:
177
-
183
Computational Parameter Study Of Chip Scale Package Array Cooling
(Article)
Subject:
Chip Seal
,
Electronic Packaging
,
Thermal Management
Author:
Sean P.
Watson
Bruce T.
Murray
Bahgat G.
Sammaki
page:
184
-
190
A Study Of Compact Thermal Model Topologies In Cfd For Flip Plastic Ball Grid Array Package
(Article)
Subject:
Air Cooling
,
Compact Models
,
Component-Based Modelling
Author:
Sarang
Shidore
Vance
Adams
Tien-Yu
Tom Lee
page:
191
-
198
A Novel Approach To The Design Of Complex Heat Transfer Systems Portable Computer Design A Case Study
(Article)
Subject:
Air Cooling
,
Thermal Resistance
,
Electronic Packaging
Author:
Sarang
Shidore
Vance
Adams
page:
199
-
206
Modeling Contact Between Rigid Sphere Bonded To Rigid Substrate
(Article)
Subject:
Contact Angle
,
Elastomer
,
Thermal Contact Resistance
Author:
Mirko
Stevanovic
M. Michael
Yovanovich
J. Richard
Culham
page:
207
-
212
Thermal Characterization Of A Liquid Cooled Aisic Base Plate With Integral Pin Fins
(Article)
Subject:
Computation Fluid Dynamics
,
Thermal Management
,
Pressure
Author:
Kevin A.
Moores
Yogendra K.
Joshi
Gerhard H.
Schiroky
page:
213
-
219
High Heat Flux Heat Pipe Mechanism For Cooling Of Electronics
(Article)
Subject:
Pulsating Edge
,
High Heat Flux Coling
,
Wick
Author:
Z. J
Zuo
Mark T.
North
Kevin L.
Wert
page:
220
-
225
Advanced Thermal Tester For Accurate Measurement Of Internal Thermal Resistance Of High Power Electronic Modules
(Article)
Subject:
Electronics
,
Internal Resistance
,
Interface Materials
Author:
Kamal K.
Sikka
page:
226
-
232
Rf Electrical Measurements Of Fine Pitch Bga Packages
(Article)
Subject:
Calibration Flxture
,
Fine Particles (Mastic)
,
Test Fixture
Author:
Michael F.
Caggiano
Jack
Ou
David
Lischner
page:
233
-
240
The Effect Of Power Cycling On The Reliability Of Lead-Free Surface Mount Assembies
(Article)
Subject:
Accelerated Aging
,
Lead-Free Solder
,
Reliability
Author:
Elaine
Davitt
Frank A.
Stam
John
Barrett
page:
241
-
249
Statistics Of Electric Conductance Through Anisotropically Conductive Adhesive
(Article)
Subject:
Anisotropically Conductive Adhesive Film
,
Constriction-Size Distribution
,
Electric Conduction
Author:
Ying
Fu
Magnus
Willander
Johan
Liu
page:
250
-
255
Numerical Modeling Of Interfacial Delamination Propagation In A Novel Peripheral Array Package
(Article)
Subject:
Delamination
,
Energy Release Rate
,
Fracture Toughness
Author:
Richard J.
Harries
Suresh K.
Sitaraman
page:
256
-
264
Interfacialfracture Toughness For Delamination Growth Prediction In A Novel Peripheral Array Package
(Article)
Subject:
Delamination
,
Electronic Packaging
,
Fracture Toughness
Author:
Viswanthan
Sundararman
Suresh K.
Sitaraman
page:
265
-
270
Application Of Ai/Pi Composite Bumps To Cog Bonding Process
(Article)
Subject:
Bonding
,
Cog
,
Probing Technique
Author:
Jen--Huang
Jeng
T. E.
Hsieh
page:
271
-
278
Software Based Analysis Of Radio Frequency Plasma Display Panel For Efficient Design And Impedance Matching
(Article)
Subject:
Impedance Matching
,
Matching
,
Plasma Display Panel
Author:
Ki Hyuk
Kim
H
Park
Sung Wook
Hwang
page:
279
-
284
Relianility Of Soldered Joints On Csps Of Various Designs And Mounting Conditions
(Article)
Subject:
Csp
,
Fem Analysis
,
Thermal Factors
Author:
Tomoki
Sato
Masato
Sumikawa
page:
293
-
299
On The Sesign Paraneters Of Flip-Chip Pbga Package Assembly For Optimum Solder Ball Reliability
(Article)
Subject:
Far Infrared Radiation
,
Warpage
,
Solder Ball Reliability
Author:
Kaushal
Verma
Seung Bin
Park
Bongtae
Han
page:
300
-
307
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