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Magazine Name : Ieee Transactions On Components And Packaging Technologies

Year : 2001 Volume number : 24 Issue: 02

Assessment Of High-Heat Flux Thermal Management Schemes (Article)
Subject: Avionics , Electronic Cooling , Flow Boiling , Spray
Author: I Mudawar     
page:      122 - 141
Modeling Of The Thermal And Hydraulic Performance Of Plate Fine, And Pin Fin Heat Sinks Influence Of Flow Bypass (Article)
Subject: Bypass , Circularity , Experimental , Heat Sink
Author: Hans Jonsson      Bahram Moshfegh     
page:      142 - 149
Design For Manufacturability Of Sise Parallel Plate Forced Convection Heat Sinks (Article)
Subject: Bonding , Design For Manufacturability , Folding Adc'S , Forging
Author: Madhusudan Lyengar      Avram Bar-Cohen     
page:      150 - 158
Optimization Of Plate Fin Heat Sinks Using Entropy Generation Minimization (Article)
Subject: Electronics , Entropy Production , Optimization
Author: J. Richard Culham      Y. S Muzychka     
page:      159 - 165
Immersion-Cooled Heat Sinks For Electronices Insight From High Speed Photography (Article)
Subject: Heat Transfer , Passive Thermal , Thermal Management
Author: Sushil H. Bhavnani      Richard C. Jaeger     
page:      166 - 176
A Methodlogy For The Design Of Perforated Tiles In Raised Floor Data Centers Using Computational Flow Analysis (Article)
Subject: Data Center Management , Flow Boiling , Flow Network Modeling
Author: Sukhvinder Kang      Roger R. Schmidt     
page:      177 - 183
Computational Parameter Study Of Chip Scale Package Array Cooling (Article)
Subject: Chip Seal , Electronic Packaging , Thermal Management
Author: Sean P. Watson      Bruce T. Murray      Bahgat G. Sammaki     
page:      184 - 190
A Study Of Compact Thermal Model Topologies In Cfd For Flip Plastic Ball Grid Array Package (Article)
Subject: Air Cooling , Compact Models , Component-Based Modelling
Author: Sarang Shidore      Vance Adams      Tien-Yu Tom Lee     
page:      191 - 198
A Novel Approach To The Design Of Complex Heat Transfer Systems Portable Computer Design A Case Study (Article)
Subject: Air Cooling , Thermal Resistance , Electronic Packaging
Author: Sarang Shidore      Vance Adams     
page:      199 - 206
Modeling Contact Between Rigid Sphere Bonded To Rigid Substrate (Article)
Subject: Contact Angle , Elastomer , Thermal Contact Resistance
Author: Mirko Stevanovic      M. Michael Yovanovich      J. Richard Culham     
page:      207 - 212
Thermal Characterization Of A Liquid Cooled Aisic Base Plate With Integral Pin Fins (Article)
Subject: Computation Fluid Dynamics , Thermal Management , Pressure
Author: Kevin A. Moores      Yogendra K. Joshi      Gerhard H. Schiroky     
page:      213 - 219
High Heat Flux Heat Pipe Mechanism For Cooling Of Electronics (Article)
Subject: Pulsating Edge , High Heat Flux Coling , Wick
Author: Z. J Zuo      Mark T. North      Kevin L. Wert     
page:      220 - 225
Advanced Thermal Tester For Accurate Measurement Of Internal Thermal Resistance Of High Power Electronic Modules (Article)
Subject: Electronics , Internal Resistance , Interface Materials
Author: Kamal K. Sikka     
page:      226 - 232
Rf Electrical Measurements Of Fine Pitch Bga Packages (Article)
Subject: Calibration Flxture , Fine Particles (Mastic) , Test Fixture
Author: Michael F. Caggiano      Jack Ou      David Lischner     
page:      233 - 240
The Effect Of Power Cycling On The Reliability Of Lead-Free Surface Mount Assembies (Article)
Subject: Accelerated Aging , Lead-Free Solder , Reliability
Author: Elaine Davitt      Frank A. Stam      John Barrett     
page:      241 - 249
Statistics Of Electric Conductance Through Anisotropically Conductive Adhesive (Article)
Subject: Anisotropically Conductive Adhesive Film , Constriction-Size Distribution , Electric Conduction
Author: Ying Fu      Magnus Willander      Johan Liu     
page:      250 - 255
Numerical Modeling Of Interfacial Delamination Propagation In A Novel Peripheral Array Package (Article)
Subject: Delamination , Energy Release Rate , Fracture Toughness
Author: Richard J. Harries      Suresh K. Sitaraman     
page:      256 - 264
Interfacialfracture Toughness For Delamination Growth Prediction In A Novel Peripheral Array Package (Article)
Subject: Delamination , Electronic Packaging , Fracture Toughness
Author: Viswanthan Sundararman      Suresh K. Sitaraman     
page:      265 - 270
Application Of Ai/Pi Composite Bumps To Cog Bonding Process (Article)
Subject: Bonding , Cog , Probing Technique
Author: Jen--Huang Jeng      T. E. Hsieh     
page:      271 - 278
Software Based Analysis Of Radio Frequency Plasma Display Panel For Efficient Design And Impedance Matching (Article)
Subject: Impedance Matching , Matching , Plasma Display Panel
Author: Ki Hyuk Kim      H Park      Sung Wook Hwang     
page:      279 - 284
Relianility Of Soldered Joints On Csps Of Various Designs And Mounting Conditions (Article)
Subject: Csp , Fem Analysis , Thermal Factors
Author: Tomoki Sato      Masato Sumikawa     
page:      293 - 299
On The Sesign Paraneters Of Flip-Chip Pbga Package Assembly For Optimum Solder Ball Reliability (Article)
Subject: Far Infrared Radiation , Warpage , Solder Ball Reliability
Author: Kaushal Verma      Seung Bin Park      Bongtae Han     
page:      300 - 307